Product Line Manager in North Carolina

Micross Advanced Interconnect Technology (MAIT) is seeking an experienced Business Development person to help grow its Wafer Level Packaging and 3D Heterogeneous Integration (3DHI) product lines with a focus on pre-selling the 200-300mm wafer processing capacity coming online in late 2025 at the Research Triangle Park, NC facility. This position will serve primarily as an outward facing Business Development person identifying and developing opportunities with existing and potential clients in support of the Inside Sales/Business Development Team and with assistance from Micross Components’ Group Sales Team. Exceptional candidates will have a strong technical background and experience in technical marketing and business development in the semiconductor packaging industry with a proven track record of independently seeking out and developing new business opportunities.  Experience in the Aerospace & Defense industry is...