3D Heterogeneous Integration Development Engineer (Semiconductors)

Summary:      

This position will support the Micross 3D Heterogeneous Integration program areas, including:

• Development of semiconductor advanced packaging processes and technologies

• 2.5/3D integration:  TSV processing, wafer thinning & handle wafer processes, thermal compression bonding, etc.
• 3D microstructure fabrication, including monolithic fabrication on device wafers
• Wafer-level packaging & interconnects: bumps, Cu pillars, & redistribution

Primary responsibilities of this member of the engineering staff are to support Program Managers and technology development projects in the form of day-to-day project management to ensure customer deliverables and internal development project deliverables are successful and remain on schedule.  The position responsibilities include process development, building process flows & lot...