Wafer Processing Engineer - IRSP (2nd Shift)

Summary:

The position will primarily focus on learning and supporting wafer processing steps required to further develop and build IR emitter pixels for the IRSP program area. This includes sputter depositions, reactive sputter depositions, ion milling, RIE, descums, ultrasonic (US) resist strips, microscope inspections, and thin film metrology. The successful candidate will need to develop an understanding of relevant process integration dependencies (e,g. interaction of patterned resist with etch processes). As time permits, a secondary goal is to become familiar with the process flows required to fabricate advanced interconnects on passive and/or active device wafers (e.g. through-Si Vias (TSV), flip-chip bumps, Cu pillars, redistribution layers, and high density microbumps). This position will support both externally and internally funded projects.

Requirements

Essential Duties & Responsibilities:

• Hands-on engineering resource for fabricating IR emitter pixels on test and device wafers.
• Participate and conduct process improvement experiments, as needed; accurately recording and reporting data
• Employ standard troubleshooting protocols
• Comply with all safety policies, practices and procedures.
• Comply with all quality and ITAR policies, practices and procedures.
• Build meaningful and productive relationships with internal business partners.
• Participate in proactive team efforts to achieve departmental and company goals.
• Contribute to building a positive team spirit.
• Communicate effectively with all levels of employees.
• Protect confidential information by not communicating, disclosing to, or using for benefit of 3rd parties.
• Maintain the highest degree of honesty and integrity at all times.
• Perform other duties as assigned.

Other Duties & Responsibilities:

Job Qualifications:

• US citizenship or permanent resident alien status is required.
• B.S., M.S., or PhD in physical science or engineering with wafer processing experience
• Knowledge of wafer processes and basic device processing, with a good background in thin film deposition, dry/wet etch, or photolithography.
• Overall experience with metrology measurements, data recording, and data presentation (PowerPoint) is a plus.

Job Skills:

• Excellent hands-on laboratory skills
• Excellent written and verbal communication skills
• Should be able to collect and analyze data.
• Proficient in Microsoft Office.
• Be able to generate reports.
• Should possess strong analytical skills.

Salary and benefits commensurate with qualifications and experience.